US awards USD 458 mln to SK Hynix for chips packaging facility 0 20.12.2024 09:41 Telecompaper.com (Telecompaper) The US Commerce Department has granted SK Hynix up to USD 458 million in direct funding to build a new chips packaging plant in Indiana... Moscow.media Частные объявления сегодня Rss.plus Все новости за 24 часа
